PCB Plating
선우하이테크의 기술을 집약한 PCB 표면처리설비입니다.
PCB Plating
선우하이테크의 기술을 집약한 PCB 표면처리설비입니다.
Ni-Au Plating Line
Featue
- Full Automation Control(Auto Loading & Unloading)
- Type : Gate Type
- Customization Available
a. Board Thickness : 0.1 ~ 2.5 t
b. Board Size : W400 ~ 550, H450 ~ 620
c. Capa : 5,000 ~ 15,000 m2/month
d. LayOut
- Auto Chemical Analysis Function System
- Dry Contact Jig : Easy maintenance
Customize Options
- Material : Ti/SUS/PTFE
- Rack : 2~5 Board / 1 Rack Bar
- Particle Control System
- Anode Rectifier System (개별 정류기)
Applications
HDI/MLB/PKG/BGA
Process
Load - Acid Cleaner - H/Rinse - Rinse - S/E - Rinse - Ni - Rinse - Au - Rinse - Unload